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IPC J-STD-005B

Requirements for Soldering Pastes

standard by Association Connecting Electronics Industries , 03/01/2024

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Full Description

This standard prescribes general requirements for the characterization and testing of solder pastes used to make high quality electronic interconnections. This specification is a material quality control document and is not intended to relate directly to the material’s performance in the assembly process. Solder paste users are referred to paragraph 6.3 for a listing of requirements information and options that should be addressed when procuring solder paste.

 

Product Details

Published:
03/01/2024
ISBN(s):
9781638161707
ANSI:
ANSI Approved
Number of Pages:
24
File Size:
1 file , 1.3 MB
Note:
This product is unavailable in Russia, Ukraine, Belarus
 

Document History

  1. IPC J-STD-005B

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    Requirements for Soldering Pastes

    • Most Recent

  2. IPC J-STD-005A


    Requirements for Soldering Pastes

    • Historical Version

  3. IPC J-STD-005


    Requirements for Soldering Pastes, Includes Amendment 1 (2007)

    • Historical Version