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About This Item


Full Description

This standard prescribes general requirements for the characterization and testing of solder pastes used to make high quality electronic interconnections. This specification is a material quality control document and is not intended to relate directly to the material’s performance in the assembly process. Solder paste users are referred to paragraph 6.3 for a listing of requirements information and options that should be addressed when procuring solder paste.


Document History

  1. IPC J-STD-005B

    👀 currently

    Requirements for Soldering Pastes

    • Most Recent
  2. IPC J-STD-005A

    Requirements for Soldering Pastes

    • Historical Version
  3. IPC J-STD-005

    Requirements for Soldering Pastes, Includes Amendment 1 (2007)

    • Historical Version