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IEC 60749-14 Ed. 1.0 b:2003

Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity)

standard by International Electrotechnical Commission , 08/07/2003

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Full Description

Provides various tests for determining the integrity between the lead/package interface and the lead itself when the lead(s) are bent due to faulty board assembly followed by rework of the part for re-assembly. Applicable to all through-hole devices and surface-mount devices requiring lead forming by the user.
 

Product Details

Edition:
1.0
Published:
08/07/2003
Number of Pages:
27
File Size:
1 file , 570 KB
Note:
This product is unavailable in Ukraine, Russia, Belarus, Canada