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About This Item

 

Full Description

IEC 60749-4:2017 provides a highly accelerated temperature and humidity stress test (HAST) for the purpose of evaluating the reliability of non-hermetic packaged semiconductor devices in humid environments. This edition includes the following significant technical changes with respect to the previous edition:
a) clarification of requirements for temperature, relative humidity and duration detailed in Table 1;
b) recommendations that current limiting resistor(s) be placed in the test set-up to prevent test board or DUT damage;
c) allowance of additional time-to-test delay or return-to-stress delay.
 

Document History

  1. IEC 60749-4 Ed. 2.0 b:2017

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    Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST)

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  2. IEC 60749-4 Ed. 2.0 en:2017


    Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST)

    • Historical Version
  3. IEC 60749-4 Ed. 1.0 b CORR1:2003


    Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST)

    • Historical Version
  4. IEC 60749-4 Ed. 1.0 b:2002


    Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST)

    • Historical Version