31.190: Electronic component assemblies

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  1. Std

    VDI/VDE 3715▹

    SMD - Surface Mount Devices - Process measurement and testing for printed circuit boards (PCB)

    standard by German Association for Electrical, Electronic and Information Technologies, 05/01/1995.

    Languages:

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  2. HISTORICAL

    Std

    DIN EN 60068-2-69▹ [ Withdrawn ]

    This document has been replaced. View the most recent version.

    Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method (IEC 60068-2-69:2017); German version EN 60068-2-69:2017

    standard by DIN-adopted European Standard, 01/01/2018.

    Languages: German

    Corrigenda: DIN EN 60068-2-69 Corrigendum 1 (2018)

    Historical Editions: DIN EN 60068-2-69 (2020), DIN EN 60068-2-69/A1 - DRAFT (2018), DIN EN 60068-2-69 Corrigendum 1 (2018), DIN EN 60068-2-69 - DRAFT (2014), DIN EN 60068-2-69 (2007), DIN EN 60068-2-54 (2007)

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  3. Std

    DIN EN 60068-2-69▹

    Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method (IEC 60068-2-69:2017 + COR1:2018 + A1:2019); German version EN 60068-2-69:2017 + AC:2018 + A1:2019

    standard by DIN-adopted European Standard, 03/01/2020.

    Languages: German

    Historical Editions: DIN EN 60068-2-69/A1 - DRAFT (2018), DIN EN 60068-2-69 Corrigendum 1 (2018), DIN EN 60068-2-69 (2018), DIN EN 60068-2-69 - DRAFT (2014), DIN EN 60068-2-69 (2007), DIN EN 60068-2-54 (2007)

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  4. HISTORICAL

    Std

    DIN EN 60068-2-69/A1 - DRAFT▹ [ Withdrawn ]

    This document has been replaced. View the most recent version.

    Draft Document - Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method (IEC 91/1499/CD:2018); Text in German und English

    standard by DIN-adopted European Standard, 06/01/2018.

    Languages: German, English

    Historical Editions: DIN EN 60068-2-69 (2020), DIN EN 60068-2-69 Corrigendum 1 (2018), DIN EN 60068-2-69 (2018), DIN EN 60068-2-69 - DRAFT (2014), DIN EN 60068-2-69 (2007), DIN EN 60068-2-54 (2007)

    Priced From:

  5. HISTORICAL

    Std

    DIN EN 60068-2-69 Corrigendum 1▹ [ Withdrawn ]

    This document has been replaced. View the most recent version.

    Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method (IEC 60068-2-69:2017/COR1:2018); German version EN 60068-2-69:2017/AC:2018-03

    Corrigenda by DIN-adopted European Standard, 05/01/2018.

    Languages: German

    Historical Editions: DIN EN 60068-2-69 (2020), DIN EN 60068-2-69/A1 - DRAFT (2018), DIN EN 60068-2-69 (2018), DIN EN 60068-2-69 - DRAFT (2014), DIN EN 60068-2-69 (2007), DIN EN 60068-2-54 (2007)

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  6. Std

    DIN EN 60917-2▹

    Modular order for the development of mechanical structures for electronic equipment practices - Part 2: Sectional specification; interface coordination dimensions for the 25 mm equipment practice (IEC 60917-2:1992); German version EN 60917-2:1994

    standard by DIN-adopted European Standard, 09/01/1994.

    Languages: German

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  7. MOST RECENT

    Std

    DIN EN IEC 61188-6-2▹

    Circuit boards and circuit board assemblies - Design and use - Part 6-2: Land pattern design - Description of land pattern for the most common surface mounted components (SMD) (IEC 61188-6-2:2021); German version EN IEC 61188-6-2:2021

    standard by DIN EN IEC, 03/01/2023.

    Languages: German

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  8. HISTORICAL

    Std

    DIN EN IEC 61188-6-2 - DRAFT▹ [ Withdrawn ]

    This document has been replaced. View the most recent version.

    Draft Document - Circuit boards and circuit board assemblies - Design and use - Part 6-2: Land pattern design - Description of land pattern for the most common surface mounted components (SMD) (IEC 91/1637/CDV:2020); German and English version prEN IEC 61188-6-2:2020

    standard by DIN EN IEC, 04/01/2021.

    Languages: German, English

    Historical Editions: DIN EN IEC 60335-2-90, DIN EN 60335-2-90/A1 - DRAFT (2021), DIN EN IEC 61188-6-2 - DRAFT (2021), DIN EN 60335-2-90 (2011), DIN EN 60335-2-90/A1 - DRAFT (2008), DIN EN 60335-2-90 (2006)

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  9. HISTORICAL

    2000914

    DIN EN 61188-6-4 - DRAFT▹ [ Withdrawn ]

    This document has been replaced. View the most recent version.

    Draft Document - Printed boards and printed board assemblies - Design and use - Part 6-4: Generic requirements for dimensional drawings of SMDs from viewpoint of land-pattern design (IEC 91/1452/CD:2017)

    standard by DIN-adopted European Standard, 12/01/2017.

    Languages: German, English

    Historical Editions: DIN EN IEC 61188-6-4 (2020)

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  10. HISTORICAL

    Std

    DIN EN 61188-7▹

    This document has been replaced. View the most recent version.

    Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction (IEC 61188-7:2009); German version EN 61188-7:2009

    standard by DIN-adopted European Standard, 12/01/2009.

    Languages: German

    Historical Editions: DIN EN 61188-7 (2017), DIN EN 61188-7 - DRAFT (2016), DIN EN 61188-7 - DRAFT (2007)

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