31.180: Printed circuits and boards

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  1. BS 07/30164977 DC▹

    EN 61249-2-32. Materials for printed boards and other interconnecting structures. Part 2-32. Reinforced base materials clad and unclad for high frequency application. Halogenated modified or unmodified resin system, woven E-glass laminated sheets of defined relative permittivity (equal or less then

    standard by BSI Group, 04/20/2007.

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  2. BS 07/30164981 DC▹

    EN 61249-2-33. Materials for printed boards and other interconnecting structures. Part 2-33. Reinforced base materials clad and unclad for high frequency application. Non-halogenated modified or unmodified resin system, woven E-glass laminated sheets of defined relative permittivity (equal or less t

    standard by BSI Group, 04/20/2007.

    Languages:

    • 👥MULTI-USER

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  3. BS 07/30164985 DC▹

    BS EN 61249-2-34. Materials for printed boards and other interconnecting structures. Part 2-34. Reinforced base materials clad and unclad for high frequency application. Non-halogenated modified or unmodified resin system, woven E-glass laminated sheets of defined relative permittivity (equal or les

    standard by BSI Group, 04/20/2007.

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  4. BS 07/30164989 DC▹

    EN 61249-2-36. Materials for printed boards and other interconnecting structures. Part 2-36. Reinforced base materials clad and unclad. Epoxide woven E-glass laminated sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly

    standard by BSI Group, 04/20/2007.

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  5. BS 07/30164993 DC▹

    EN 61249-2-37. Materials for printed boards and other interconnecting structures. Part 2-37. Reinforced base materials clad and unclad. Modified non-halogenated epoxide woven E-glass laminated sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly

    standard by BSI Group, 04/20/2007.

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  6. BS 07/30164997 DC▹

    EN 61249-2-38. Materials for printed boards and other interconnecting structures. Part 2-38. Reinforced base materials clad and unclad. Non-halogenated epoxide woven E-glass laminated sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly

    standard by BSI Group, 04/20/2007.

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  7. BS 07/30174325 DC▹

    BS EN 61249-2-41. Materials for printed circuit boards and other interconnecting structures. Part 2-41. Reinforced base materials, clad and unclad. Brominated expoide cellulose paper/woven E-glass reinforced laminated sheets of defined flammability (vertical burnning test), copper-clad for lead-free

    standard by BSI Group, 11/27/2007.

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  8. BS 09/30178203 DC▹

    BS EN 61193-3. Quality assessment systems. Part 3. Selection and use of sampling plans for printed board and laminate end-product and in-process auditing

    standard by BSI Group, 03/10/2009.

    Languages:

    • 👥MULTI-USER

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  9. BS 09/30179135 DC▹

    BS EN 61249-2-42. Materials for printed boards and other interconnecting structures. Part 2-42. Reinforced base materials clad and unclad. Brominated Epoxide non-woven /woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly

    standard by BSI Group, 03/10/2009.

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  10. BS 09/30201049 DC▹

    BS EN 61249-2-41. Materials for printed boards and other interconnecting structures. Part 2-41. Reinforced base materials clad and unclad. Brominated Epoxide cellulose paper /woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly

    standard by BSI Group, 03/10/2009.

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