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About This Item
Full Description
Cross References:
IEC 60068-2-20:1979
IEC 60749-3
CENELEC HD 323.2.20 S3:1988
EN 60749-3:2002
Document History
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BS EN IEC 60749-20:2020
Semiconductor devices. Mechanical and climatic test methods-Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat- Most Recent
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BS EN 60749-20:2009
Semiconductor devices. Mechanical and climatic test methods-Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat- Historical Version
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BS EN 60749-20:2003
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Semiconductor devices. Mechanical and climatic test methods-Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat- Historical Version
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BS EN 60749:1999
Semiconductor devices. Mechanical and climatic test methods- Historical Version
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BS 6493-3:1985
Semiconductor devices-Mechanical and climatic test methods- Historical Version