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About This Item
Full Description
Cross References:
IEC 60068-2-20:2008
IEC 60749-3
IEC 60749-35
EN 60068-2-20:2008
EN 60749-3:2002
EN 60749-35:2006
All current amendments available at time of purchase are included with the purchase of this document.
Document History
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BS EN IEC 60749-20:2020
Semiconductor devices. Mechanical and climatic test methods-Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat- Most Recent
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BS EN 60749-20:2009
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Semiconductor devices. Mechanical and climatic test methods-Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat- Historical Version
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BS EN 60749-20:2003
Semiconductor devices. Mechanical and climatic test methods-Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat- Historical Version
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BS EN 60749:1999
Semiconductor devices. Mechanical and climatic test methods- Historical Version
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BS 6493-3:1985
Semiconductor devices-Mechanical and climatic test methods- Historical Version