1663809

BS EN 60749-20:2009

Semiconductor devices. Mechanical and climatic test methods-Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat

standard by British-Adopted European Standard , 01/31/2010

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Cross References:
IEC 60068-2-20:2008
IEC 60749-3
IEC 60749-35
EN 60068-2-20:2008
EN 60749-3:2002
EN 60749-35:2006


All current amendments available at time of purchase are included with the purchase of this document.
 

Product Details

Published:
01/31/2010
ISBN(s):
9780580594786
Number of Pages:
32
File Size:
1 file , 1.8 MB
Product Code(s):
30168485, 30168485, 30168485
Note:
This product is unavailable in Ukraine, Russia, Belarus
 

Document History

  1. BS EN IEC 60749-20:2020


    Semiconductor devices. Mechanical and climatic test methods-Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat

    • Most Recent

  2. BS EN 60749-20:2009

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    Semiconductor devices. Mechanical and climatic test methods-Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat

    • Historical Version

  3. BS EN 60749-20:2003


    Semiconductor devices. Mechanical and climatic test methods-Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat

    • Historical Version

  4. BS EN 60749:1999


    Semiconductor devices. Mechanical and climatic test methods

    • Historical Version

  5. BS 6493-3:1985


    Semiconductor devices-Mechanical and climatic test methods

    • Historical Version