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BS EN IEC 60749-20:2020

Semiconductor devices. Mechanical and climatic test methods-Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat

standard by British-Adopted European Standard , 10/14/2020

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About This Item

 

Full Description

This part of IEC 60749 provides a means of assessing the resistance to soldering heat of semiconductors packaged as plastic encapsulated surface mount devices (SMDs). This test is destructive.

All current amendments available at time of purchase are included with the purchase of this document.
 

Product Details

Published:
10/14/2020
ISBN(s):
9780539045840
Number of Pages:
32
File Size:
1 file , 1.5 MB
Product Code(s):
30394486, 30394486, 30394486
Note:
This product is unavailable in Ukraine, Russia, Belarus
 

Document History

  1. BS EN IEC 60749-20:2020

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    Semiconductor devices. Mechanical and climatic test methods-Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat

    • Most Recent

  2. BS EN 60749-20:2009


    Semiconductor devices. Mechanical and climatic test methods-Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat

    • Historical Version

  3. BS EN 60749-20:2003


    Semiconductor devices. Mechanical and climatic test methods-Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat

    • Historical Version

  4. BS EN 60749:1999


    Semiconductor devices. Mechanical and climatic test methods

    • Historical Version

  5. BS 6493-3:1985


    Semiconductor devices-Mechanical and climatic test methods

    • Historical Version